Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616
Silicone Potting  9616
Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616 Silicone Potting  9616

Silicone Potting 9616

449.00 INR/Kilograms

Product Details:

  • Material Silicone
  • Tensile Strength 1.5 3.5 Megapascals (MPa )
  • Packaging Size 25kg bucket of Part A Compound + 25kg bucket of Part B Compound
  • Features Minimal shrinkage, high thermal conductivity (1.61.8 W/mK), waterproof, shock-proof, non-corrosive, RoHS compliant, good electrical insulation, and wide operating temperature (-50C to 200C).
  • Form Paste
  • Hardness Shore Hardness (A): 50 80
  • Surface Of Application PC, ABS, epoxy, and other electronic substrates
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Silicone Potting 9616 Price And Quantity

  • 50 Kilograms
  • 449.00 INR/Kilograms

Silicone Potting 9616 Product Specifications

  • Other
  • 10 Millimeter (mm)
  • Part A: Gray, Part B: White
  • 99.9%
  • Two-Part Silicone Potting Compound (1.6 TC)
  • Other
  • Other
  • Silicone
  • 1.5 3.5 Megapascals (MPa )
  • 25kg bucket of Part A Compound + 25kg bucket of Part B Compound
  • Minimal shrinkage, high thermal conductivity (1.61.8 W/mK), waterproof, shock-proof, non-corrosive, RoHS compliant, good electrical insulation, and wide operating temperature (-50C to 200C).
  • Paste
  • Shore Hardness (A): 50 80
  • Industrial Grade
  • PC, ABS, epoxy, and other electronic substrates
  • 6 Months
  • Potting of electronic components such as high-power LEDs, sensors, transformers, power modules, and automotive ignition systems.
  • 50 to 200 Celsius (oC)
  • 1.5 3.5 Megapascals (MPa )

Silicone Potting 9616 Trade Information

  • ICD Dadri (Greater Noida), India
  • Cash Against Delivery (CAD), Cash on Delivery (COD), Cash Advance (CA), Cash in Advance (CID), Cheque, Letter of Credit (L/C)
  • 50000 Kilograms Per Month
  • 1 Days
  • Free samples are available
  • 25 kg Part A bucket + 25 kg Part B bucket (total 50 kg set)
  • Asia
  • All India
  • RoHS 2002/95/EC Compliant, Lead-Free

Product Description


Key Differentiators
o High thermal conductivity of 1.6 watts per meter kelvin
o Cures at room temperature without exothermic reaction
o Stable viscosity with smooth flow and easy mixing
o Adheres well to most electronic materials without primer
o RoHS compliant and lead free



Product Features
o Soft and durable cured surface with Shore A 50 to 80 hardness
o Volume resistivity greater than 1.0 times ten to the power of fourteen ohm centimeter
o Dielectric strength of 10 kilovolts per millimeter
o Thermal conductivity between 1.6 and 1.8 watts per meter kelvin
o Excellent resistance to moisture, shock, and temperature extremes
o Long pot life and full cure within 24 hours
o Compatible with automated glue filling equipment



Industrial Applications
o Encapsulation of high power LED bulbs
o Potting of sensors, transformers, and signal amplifiers
o Sealing of HID stabilizers and ignition modules in automotive systems
o Moisture and voltage protection for PCBs and power modules
o Protection of general electronics under harsh environmental conditions



Compatible Surfaces
o Polycarbonate PC
o Acrylonitrile Butadiene Styrene ABS
o Epoxy
o Metal enclosures
o Printed circuit boards PCBs



Frequently Asked Questions

Q1 What is the recommended mixing ratio
A1 Mix Part A and Part B in a 1 to 1 ratio by weight. After stirring Part A and shaking Part B, mix both thoroughly for 5 to 10 minutes.

Q2 Is vacuum degassing necessary
A2 For encapsulation below 10 millimeters, natural defoaming is sufficient. For thicker sections, degassing under vacuum at 70 millimeters of mercury for 3 minutes is recommended.

Q3 What is the curing time
A3 Surface drying occurs in 30 to 90 minutes. Full curing is typically complete within 8 to 24 hours depending on ambient temperature.

Q4 Is a primer required for adhesion
A4 No. Primer is not required. It adheres well to PC, ABS, Epoxy, and other materials without additional surface treatment.

Q5 Is the product safe and compliant
A5 Yes. It is lead free and compliant with RoHS 2002 95 EC standards.

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