6103 200 GM SMT Red Glue

Product Description

• Good adhesion to most common substrates
• Rapid curing for secure component attachment before solder reflow
• Extremely low moisture absorption to prevent voids and defects
• Proven non-corrosive formula protects sensitive electronics
• Ideal viscosity and thixotropic index for precision stencil printing
• Tested to maintain performance in high-heat, high-stress environments

APPLICATIONS

• Used for bonding and fixing SMT components on printed circuit boards
• The fast curing properties make it particularly suitable for SMT production requirements

HANDLING AND SAFETY

• Handling: Take care, stay away from oxidability material. keep the container sealed well, avoid water or moisture.Wear protective equipment, equip with well ventilating appliances. Avoid eye contact ;avoid inhaling smog and keep the container sealed well. Satisfactory industrial hygiene should come into operation, please clean thoroughly after handling especially before eating and smoking.
• Storage: Take care, stay away from oxidability material. keep the container sealed well, avoid water or moisture.