विशेषताएँMinimal shrinkage, high thermal conductivity (1.6–1.8 W/m·K), waterproof, shock-proof, non-corrosive, RoHS compliant, good electrical insulation, and wide operating temperature (-50°C to 200°C).
Potting of electronic components such as high-power LEDs, sensors, transformers, power modules, and automotive ignition systems.
25kg bucket of Part A Compound + 25kg bucket of Part B Compound
Industrial Grade
99.9%
मिलीमीटर (mm)
PC, ABS, epoxy, and other electronic substrates
Two-Part Silicone Potting Compound (1.6 TC)
मेगापास्कल (एमपीए)
Paste
सेल्सियस (oC)
Part A: Gray, Part B: White
मेगापास्कल (एमपीए)
Minimal shrinkage, high thermal conductivity (1.6–1.8 W/m·K), waterproof, shock-proof, non-corrosive, RoHS compliant, good electrical insulation, and wide operating temperature (-50°C to 200°C).
व्यापार सूचना
ICD Dadri (Greater Noida), India
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प्रति महीने
दिन
25 kg Part A bucket + 25 kg Part B bucket (total 50 kg set)
RoHS 2002/95/EC Compliant, Lead-Free
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