Silicone Potting 9607 I Transparent

450.0 INR/Kilograms

Product Details:

  • Adhesive Type Other
  • Glue thickness 10 Millimeter (mm)
  • Storage Temperature 50-200 Celsius (oC)
  • Types Of Chemical Condensation-cure silicone system based on polydimethylsiloxane with alkoxysilane crosslinkers, organotin catalyst, and thermally conductive fillers (e.g., aluminum oxide).
  • Material Silicone
  • Packaging Size 25 kg Part A bucket + 25 kg Part B bucket (total 50 kg set)
  • Shelf Life 6 Months
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Silicone Potting 9607 I Transparent Price And Quantity

  • 15 Kilograms
  • 450.0 INR/Kilograms

Silicone Potting 9607 I Transparent Product Specifications

  • Paste
  • Industrial Grade
  • Shore A 55
  • 2 Megapascals (MPa )
  • 9607 Transparent Silicone Gel 9607 Dual Component Potting Silicone 9607 1 to 1 Silicone Compound 9607 High Temp Silicone Potting 9607 Heat Resistant Potting Material
  • 63148-62-9 (Polydimethylsiloxane base), 17689-77-9 (Crosslinker), 77-58-7 (Catalyst), 1344-28-1 (Filler).
  • Other
  • 2 Megapascals (MPa )
  • 6 Months
  • Encapsulation and insulation of high-power LEDs, automotive modules, transformers, sensors, signal amplifiers, power supplies, and PCBs. Ideal for waterproofing, moisture-proofing, and shock-proofing.
  • Silicone
  • 25 kg Part A bucket + 25 kg Part B bucket (total 50 kg set)
  • 99%
  • Kootai 9607 Silicone Potting Compound offers a balanced combination of thermal management, electrical insulation, and environmental durability. With a high thermal conductivity of 1.0 W/m K, it efficiently dissipates heat from sensitive components. Its wide operational temperature range of -50 C to +200 C ensures consistent performance in extreme environments. The compound features low shrinkage during curing, along with excellent resistance to moisture, shock, and weather. It provides strong electrical insulation with a volume resistivity greater than 1.0 10 ohm-centimeter. Designed for ease of use, it mixes in a 1:1 ratio and adheres well to substrates like PC, ABS, and Epoxy without the need for a primer. Kootai 9607 is lead-free, RoHS compliant, and compatible with automated dispensing systems, making it ideal for industrial-scale applications.
  • Transparent
  • Other
  • Condensation-cure silicone system based on polydimethylsiloxane with alkoxysilane crosslinkers, organotin catalyst, and thermally conductive fillers (e.g., aluminum oxide).
  • Other
  • 10 Millimeter (mm)
  • 50-200 Celsius (oC)
  • PC (Polycarbonate), ABS, Epoxy, metal surfaces, printed circuit boards (PCBs), transformers, sensors, LED modules, and automotive electronic housings.

Silicone Potting 9607 I Transparent Trade Information

  • Mumbai or New Delhi (India)
  • Cheque, Letter of Credit at Sight (Sight L/C), Cash Against Delivery (CAD), Cash on Delivery (COD), Cash Advance (CA), Cash in Advance (CID)
  • 20000 Kilograms Per Month
  • 2 Days
  • No
  • Free samples are available
  • 25 kg Part A + 25 kg Part B buckets
  • Asia
  • All India
  • RoHS Compliant (2002/95/EC), Lead-free

Product Description

Kootai 9607 Silicone Potting Compound is a two part condensation cure silicone material with thermal conductivity of 1.0 watts per meter kelvin. It offers excellent weather resistance, mechanical flexibility, and is ideal for sealing and protecting electronic components from heat, moisture, and vibration.


Engineered for encapsulation and insulation of sensitive electronics, Kootai 9607 features a balanced 1 to 1 mix ratio of base and catalyst, enabling reliable mechanical cushioning and high thermal performance. It delivers volume resistivity greater than 1.0 times ten to the power of fourteen ohm centimeter and cures through ambient moisture. The cure speed and final hardness can be adjusted by changing the catalyst ratio.


Once cured, it forms a durable non corrosive elastomer that withstands extreme temperatures from minus 50 to plus 200 degrees Celsius. It is compatible with a wide range of substrates including PC, ABS, and Epoxy, and complies with RoHS standards, being completely lead free.




Key Features


Thermal conductivity 1.0 watts per meter kelvin
Wide operational temperature range minus 50 to plus 200 degrees Celsius
Minimal shrinkage with no exothermic reaction during curing
Resistant to moisture, shock, and environmental stress
Primerless adhesion to PC, ABS, and Epoxy
Suitable for automated dispensing systems
Lead free and RoHS compliant




Typical Applications


Encapsulation of high power LED bulbs and heat sensitive components
Potting of sensors, transformers, resistors, and signal amplifiers
Sealing of automotive HID stabilizers and ignition modules
Waterproofing and protection of PCBs and power electronics
Mechanical cushioning and insulation in harsh environments




Frequently Asked Questions


Q1 What is the recommended mixing ratio and method
A1 Mix Part A and Part B in a 1 to 1 ratio by weight Stir or shake both components thoroughly before combining Mix well for 5 to 10 minutes prior to application


Q2 What is the curing time
A2 At 25 degrees Celsius surface drying occurs within 30 to 90 minutes Full curing completes within 24 hours Accelerated curing is possible by heating to 80 to 100 degrees Celsius


Q3 Is vacuum degassing required
A3 For potting depths under 10 millimeters natural defoaming is usually sufficient For thicker applications vacuum degassing around 70 millimeters of mercury for 3 minutes or more is recommended


Q4 What are its electrical insulation properties
A4 The material offers dielectric strength of 10 kilovolts per millimeter volume resistivity greater than 1.0 times ten to the power of fourteen ohm centimeter and a dielectric constant of 3 at 60 hertz


Q5 Is the product environmentally safe
A5 Yes It is lead free and fully compliant with RoHS Directive 2002 slash 95 slash EC

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