Kootai 9606 Silicone Potting Compound is a low-viscosity, 1:1 mix ratio gel formulated for effective encapsulation and thermal management in electronic systems. Designed for ease of application and optimized flow, it cures into a soft, stress-relieving silicone that provides superior shock dampening and thermal conductivity (0.80 W/m·K). With broad temperature stability from -45°C to +150°C, it ensures performance across extreme conditions.
This UL 94 V-0 rated material forms strong bonds while maintaining insulation integrity, with a dielectric strength of 18 kV/mm and volume resistivity of 1.9 × 10¹⁴ Ω·cm. Its repairable nature and compatibility with automated processing make it ideal for scalable manufacturing.
Industrial Application
Features
FAQ
Q0: what is its Thermal Conductivity?
A: Thermal conductivity of 0.80 W/m·K for efficient heat dissipation
Q1: What is the mix ratio for 9606?
A: 1:1 by weight or volume between Part A and Part B.
Q2: How long is the working time?
A: Approximately 2 hours at 25°C before viscosity begins to increase.
Q3: Can it withstand high and low temperatures?
A: Yes, it operates between -45°C to +150°C, with potential down to -55°C depending on application specifics.
Q4: Is it suitable for automated dispensing?
A: Yes, its flowability supports use with automated, airless dispensing systems.
Q5: How do you repair it once cured?
A: Simply clean the repair area, pour in new gel, and allow to cure.
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