Product Description
Kootai 2057 is a high-purity, low-solids no-clean flux specially formulated for precision soldering applications. Its unique blend of isopropyl alcohol, mineral spirits, and gum rosin ensures excellent wetting, low residue, and strong adhesion, making it ideal for both spray and foam fluxing systems. The flux is optimized to reduce solder balls and tin bridges, particularly in fine-pitch QFPs and dense SMT components, ensuring high process stability and electrical reliability.
It is suitable for PTH (plated through-hole) soldering, offers clear residue with no post-solder cleaning, and enables uniform flux distribution due to its controlled viscosity. With a flash point of 17C, proper handling and fire precautions are necessary in production environments.
Industrial Application
- - Wave soldering of PCBs with SMT or mixed technology
- - Through-hole soldering with high hole-fill reliability
- - Connector and QFP assembly in high-speed SMT lines
- - Electronic assemblies requiring clear no-clean finishes
- - Automotive, telecom, and consumer electronics
Features
- Halogen-free, low-solids (4.0%), environmentally responsible
- - Compatible with lead-free and tin-lead solder alloys
- - Reduces solder balling and bridging, ideal for fine-pitch soldering
- - Excellent wetting and hole-fill for PTH soldering
- - Fast drying, leaves clear, non-tacky residue
- - Supports spray and foam application methods
- - Flash point 17C, handle with fire safety measures
FAQ
Q1: Is 2057 flux suitable for RoHS-compliant processes?
A: Yes, it is halogen-free and fully compatible with both leaded and lead-free (RoHS) soldering applications.
Q2: What methods can be used to apply it?
A: It supports both spray and foam fluxing, enabling flexible deployment in automated and manual soldering lines.
Q3: Does it require cleaning after soldering?
A: No. As a no-clean flux, it leaves non-conductive, clear residues that do not impact circuit performance.
Q4: How does it perform with fine-pitch components?
A: Its designed to reduce solder bridging and balling, making it especially effective for dense SMT layouts.
Q5: What is the shelf life and recommended storage?
A: 12 months in a sealed container below 25C, away from heat or flame. Do not store in aluminum containers.
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