Kootai 6103 is a temperature-set epoxy adhesive specifically developed for surface mount technology (SMT) lines. It ensures components stay securely in place on the PCB during high-speed placement and pre-reflow stages. This red thixotropic gel has excellent stencil printability and stability in humid environments due to its very low moisture absorption. Once cured, it delivers durable adhesion, electrical insulation, and stable mechanical support across a range of temperatures.
Its fast-curing behaviortypically 30 minutes at 150Cand non-corrosive, anti-migration formula make it highly suitable for precision production lines. The adhesive performs reliably under moisture, thermal cycling, and soldering stress.
Industrial Application
Features
FAQ
Q1: What is the curing recommendation?
A: Cures at 150C for 30 minutes or as per SMT oven profile. Warm-up time should be factored in for actual process settings.
Q2: Can the adhesive be printed using stencils?
A: Yes. Its thixotropic index and stability ensure clean stencil printing and dot retention.
Q3: Is it safe to leave the adhesive exposed to air during operation?
A: It resists moisture pickup, but prolonged exposure may affect print quality. It should be cured promptly after printing.
Q4: What substrates is it compatible with?
A: Standard FR4 PCBs and SMT-grade component surfaces. It shows no corrosion on bronze mirror surfaces.
Q5: How should it be stored and handled?
A: Store at 28C. Before use, bring to ambient temperature (e.g., 30 mL cartridges: 24 hours; 200300 mL: 46 hours). Avoid moisture ingress and never return unused glue to the original container.
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