SMT Red Glue -6103

3800.0 आईएनआर/टुकड़ा

मूल्य/उद्धरण प्राप्त करें

उत्पाद विवरण:

कठोरता (Shore D): 82 4 (ASTM D2240; 150 C/30 min cure)
गोंद की मोटाई मिलीमीटर (mm)
पैकेजिंग का आकार 200gms
शेल्फ लाइफ महीने
होल्डिंग पावर मेगापास्कल (एमपीए)
चिपकने वाला प्रकार
अनुप्रयोग की सतह PCB, FR-4 PCB, electronic component terminations (ceramic, plastic, metal), copper pads/tracks, SMD capacitor and resistor ends, ceramic substrates in hybrid circuits.
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उत्पाद की विशेषताएं

पैकेजिंग का आकार 200gms
रंग Red
कठोरता (Shore D): 82 4 (ASTM D2240; 150 C/30 min cure)
गोंद की मोटाई मिलीमीटर (mm)
रसायन के प्रकार epoxy adhesive
स्टोरेज टेम्परेचर सेल्सियस (oC)
प्रपत्र Paste
अनुप्रयोग की सतह PCB, FR-4 PCB, electronic component terminations (ceramic, plastic, metal), copper pads/tracks, SMD capacitor and resistor ends, ceramic substrates in hybrid circuits.
शेल्फ लाइफ महीने
होल्डिंग पावर मेगापास्कल (एमपीए)
विशेषताएँ 6103 SMT Red Glue is a fast heat-curing epoxy adhesive designed for high-speed surface-mount production, offering excellent adhesion to FR-4 PCBs and electronic components. It delivers high shear strength to securely fix components before solder reflow, while its very low hygroscopicity ensures consistent performance even in humid environments. The adhesive exhibits excellent thermal stability, withstanding solder immersion at 260 C without detachment, and maintains stable viscosity for precise dispensing or stencil printing. Safe for PCB metallurgy with no bronze mirror corrosion, 6103 also provides reliable dielectric properties, making it ideal for demanding electronic assembly applications.
ग्रेड industrial
टेन्साइल स्ट्रेंथ मेगापास्कल (एमपीए)
पवित्रता 99%
एप्लीकेशन 6103 SMT Red Glue is a fast heat-curing epoxy adhesive designed for high-speed surface-mount production, offering excellent adhesion to FR-4 PCBs and electronic components. It delivers high shear strength to securely fix components before solder reflow, while its very low hygroscopicity ensures consistent performance even in humid environments. The adhesive exhibits excellent thermal stability, withstanding solder immersion at 260 C without detachment, and maintains stable viscosity for precise dispensing or stencil printing. Safe for PCB metallurgy with no bronze mirror corrosion, 6103 also provides reliable dielectric properties, making it ideal for demanding electronic assembly applications.
दुसरे नाम SMT Adhesive

व्यापार सूचना

एफओबी पोर्ट Tughlakabad Inland Container Depot (ICD) in New Delhi
भुगतान की शर्तें , , , ,
आपूर्ति की क्षमता प्रति महीने
डिलीवरी का समय दिन
नमूना उपलब्ध Yes
नमूना नीति
पैकेजिंग का विवरण 200ml
मुख्य निर्यात बाजार
मुख्य घरेलू बाज़ार
प्रमाणपत्र ISO, Reach, UL

उत्पाद वर्णन

Kootai 6103 is a temperature-set epoxy adhesive specifically developed for surface mount technology (SMT) lines. It ensures components stay securely in place on the PCB during high-speed placement and pre-reflow stages. This red thixotropic gel has excellent stencil printability and stability in humid environments due to its very low moisture absorption. Once cured, it delivers durable adhesion, electrical insulation, and stable mechanical support across a range of temperatures.

Its fast-curing behaviortypically 30 minutes at 150Cand non-corrosive, anti-migration formula make it highly suitable for precision production lines. The adhesive performs reliably under moisture, thermal cycling, and soldering stress.

Industrial Application

Component fixing during SMT assembly before reflow soldering
Die attachment for capacitors, resistors, and small active components
High-speed pick-and-place line support for lead-free solder reflow
Applications requiring dimensional control during thermal processing

Features

Fast thermal curing: 150C for 30 minutes
Thermal conductivity: 0.25 W/mK
Dielectric strength: Volume and surface resistivity ~2.110 cm
Thixotropic red gel: Printable and stable under humidity
No corrosion, no metal migration, and RoHS compliant
Excellent environmental durability: Resists aging, RH, and thermal cycling
Passed solder pot immersion at 260C per IPC-SM817 without component shift

FAQ

Q1: What is the curing recommendation?
A: Cures at 150C for 30 minutes or as per SMT oven profile. Warm-up time should be factored in for actual process settings.

Q2: Can the adhesive be printed using stencils?
A: Yes. Its thixotropic index and stability ensure clean stencil printing and dot retention.

Q3: Is it safe to leave the adhesive exposed to air during operation?
A: It resists moisture pickup, but prolonged exposure may affect print quality. It should be cured promptly after printing.

Q4: What substrates is it compatible with?
A: Standard FR4 PCBs and SMT-grade component surfaces. It shows no corrosion on bronze mirror surfaces.

Q5: How should it be stored and handled?
A: Store at 28C. Before use, bring to ambient temperature (e.g., 30 mL cartridges: 24 hours; 200300 mL: 46 hours). Avoid moisture ingress and never return unused glue to the original container.

Exceptional Adhesion & Thermal Stability

6103 SMT Red Glue offers unparalleled bonding strength for FR-4 PCBs and various electronic component surfaces such as ceramic, plastic, and metal. Its thermal stability allows it to maintain adhesion and performance even through extreme solder reflow conditions at 260C, making it a dependable choice for demanding electronic assembly lines.

Precision Dispensing with Stable Viscosity

Engineered for both automated dispensing and stencil printing, this adhesive maintains stable viscosity throughout its shelf life. This ensures accurate and consistent application, reduces waste, and improves overall process reliability in high-speed manufacturing workflows.

Reliable Performance in Humid Environments

With very low hygroscopicity, 6103 SMT Red Glue resists moisture absorption, preserving adhesive integrity in high-humidity settings. This trait guarantees lasting bond strength and dielectric protection for sensitive electronic components exposed to variable environmental conditions.

FAQs of SMT Red Glue -6103:

Q: How should 6103 SMT Red Glue be applied for optimal results in electronic assembly?

A: 6103 SMT Red Glue is best dispensed using precise equipment or stencil printing techniques onto FR-4 PCBs and component terminations. Ensure the targeted areas are clean and apply the adhesive in a uniform 6 mm thickness for secure positioning before the solder reflow process.

Q: What makes 6103 SMT Red Glue suitable for high-speed surface-mount production processes?

A: Its rapid heat-curing formulation, stable viscosity, and excellent adhesion to electronic materials make 6103 ideal for automated application and fast cycle times necessary in modern surface-mount manufacturing environments.

Q: When and how does 6103 SMT Red Glue develop its full bonding strength?

A: The adhesive develops optimal bond strength after heat curing at 150C for 30 minutes, providing high shear and tensile strength to securely hold components before soldering and throughout the assembly lifecycle.

Q: Where can this adhesive be safely used without risk of metallurgical corrosion?

A: 6103 SMT Red Glue is safe for direct application on PCB copper pads, bronze mirror metallurgy, FR-4 PCB substrates, ceramic, plastic, metal component terminations, and SMD capacitor or resistor ends, as it does not induce corrosion or degrade sensitive circuit materials.

Q: What benefits does the glue offer in humid manufacturing environments?

A: Its very low hygroscopicity ensures that moisture absorption is minimized, preserving adhesive consistency, dielectric protection, and mechanical strength, even under humid conditions prevalent in some manufacturing and assembly areas.

Q: How long can the adhesive be stored, and under what conditions?

A: 6103 SMT Red Glue has a shelf life of 6 months. It should be stored at or below 150C as specified, ensuring that the product retains its viscosity and performance attributes throughout its lifespan.

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