SMT Red Glue -6103

SMT Red Glue -6103

उत्पाद विवरण:

  • चिपकने वाला प्रकार
  • प्रपत्र Paste
  • स्टोरेज टेम्परेचर सेल्सियस (oC)
  • शेल्फ लाइफ महीने
  • उपयोग
  • पवित्रता 99%
  • रंग White
  • अधिक देखने के लिए क्लिक करें
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मूल्य और मात्रा

  • 1

उत्पाद की विशेषताएं

  • महीने
  • 99%
  • Paste
  • सेल्सियस (oC)
  • White

व्यापार सूचना

  • प्रति महीने
  • दिन

उत्पाद वर्णन

Kootai 6103 is a temperature-set epoxy adhesive specifically developed for surface mount technology (SMT) lines. It ensures components stay securely in place on the PCB during high-speed placement and pre-reflow stages. This red thixotropic gel has excellent stencil printability and stability in humid environments due to its very low moisture absorption. Once cured, it delivers durable adhesion, electrical insulation, and stable mechanical support across a range of temperatures.


Its fast-curing behaviortypically 30 minutes at 150Cand non-corrosive, anti-migration formula make it highly suitable for precision production lines. The adhesive performs reliably under moisture, thermal cycling, and soldering stress.


Industrial Application

  • - Component fixing during SMT assembly before reflow soldering
  • - Die attachment for capacitors, resistors, and small active components
  • - High-speed pick-and-place line support for lead-free solder reflow
  • - Applications requiring dimensional control during thermal processing

Features

  • - Fast thermal curing: 150C for 30 minutes
  • - Thermal conductivity: 0.25 W/mK
  • - Dielectric strength: Volume and surface resistivity ~2.110 cm
  • - Thixotropic red gel: Printable and stable under humidity
  • - No corrosion, no metal migration, and RoHS compliant
  • - Excellent environmental durability: Resists aging, RH, and thermal cycling
  • - Passed solder pot immersion at 260C per IPC-SM817 without component shift

FAQ

Q1: What is the curing recommendation?
A: Cures at 150C for 30 minutes or as per SMT oven profile. Warm-up time should be factored in for actual process settings.


Q2: Can the adhesive be printed using stencils?
A: Yes. Its thixotropic index and stability ensure clean stencil printing and dot retention.


Q3: Is it safe to leave the adhesive exposed to air during operation?
A: It resists moisture pickup, but prolonged exposure may affect print quality. It should be cured promptly after printing.


Q4: What substrates is it compatible with?
A: Standard FR4 PCBs and SMT-grade component surfaces. It shows no corrosion on bronze mirror surfaces.


Q5: How should it be stored and handled?
A: Store at 28C. Before use, bring to ambient temperature (e.g., 30 mL cartridges: 24 hours; 200300 mL: 46 hours). Avoid moisture ingress and never return unused glue to the original container.

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