Kootai 9607 Silicone Potting Compound is a dual-component, room-temperature-curing silicone engineered for encapsulation and insulation of sensitive electronics. Its balanced formulation—based on a 1:1 mix of base and catalyst—offers reliable mechanical cushioning, thermal conductivity of 1.0 W/m·K, and volume resistivity >1.0×10¹⁴ Ω·cm.
The compound cures through ambient moisture, with catalyst ratio affecting cure speed and final hardness. Once cured, it forms a durable, non-corrosive elastomer resistant to extreme temperatures from -50°C to +200°C, moisture, and environmental wear. Compatible with a wide range of materials including PC, ABS, and Epoxy, it is RoHS compliant and lead-free.
Industrial Application
Features
FAQ
Q1: What is the mixing ratio and method?
A: Mix Part A and Part B in a 1:1 ratio by weight after stirring/shaking both components. Blend thoroughly for 5–10 minutes before use.
Q2: How long does it take to cure?
A: At 25°C, surface drying occurs within 30–90 minutes; full curing takes up to 24 hours. Curing can be accelerated by heating to 80–100°C.
Q3: Is vacuum degassing needed?
A: For potting depths <10 mm, natural defoaming usually suffices. For thicker applications, degassing under vacuum (~70 mmHg for 3+ minutes) is recommended.
Q4: What are the electrical properties?
A: It offers dielectric strength of 10 kV/mm, volume resistivity >1.0×10¹⁴ Ω·cm, and a dielectric constant of 3 at 60Hz.
Q5: Is it environmentally safe?
A: Yes, it's lead-free and complies with RoHS 2002/95/EC regulations.
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